Wafer glass/bonding glass/glass wafer is used in a wide variety of technical and industrial applications. Some of these applications as below:
Semiconductors, Integrated circuit (IC) packaging, biotechnology, micro electromechanical systems (MEMS) and electronics, microlithography, anode bonded substrate, optical substrate, microsystem technology, micro mechanics, micro structure application.
Wafer material:
Pyrex 7740,Eagle xg,Borofloat,D263T,B270,H-K9L/BK7,Quartz,AF32
Processing parameters
|
Standard diameter (mm) |
25.4; 50.8;76.2;100;125;150;200; (can be customized) |
|
Standard inch |
1’’;2’’;3’’;4’’,5’’;6’’;8’’;12’’; (can be customized) |
|
Standard thickness(mm) |
0.1;0.145;0.2;0.3;0.5;0.7;1.0;1.1;1.5; (can be customized) |
|
Appearance inspection standard |
60/40; 40/20; 20/10; (can be customized) |
|
Surface roughness |
<1.5 (can be customized) |
|
Light transmittance |
>90% (can be customized) |
|
TTV |
<0.005 (can be customized) |
|
Bow |
<0.01 (can be customized) |
|
Warp |
<0.01 (can be customized) |